IW-RG658 PRO
6.5U GPU Rackmount Chassis
- GPU-optimized server, engineered for AI, deep learning, LLM, and HPC workloads
- Compatible with dual 5th Gen Intel® Xeon® Scalable processors, supporting up to 32 DDR5 DIMM slots
- Supports up to 8 x NVIDIA RTX™ 6000 Pro GPUs via pre-installed PCIe converter board
- Advanced thermal architecture with 14 × 80×56 mm PWM fans at 17,000 RPM for full-load GPU cooling
- Redundant 3+1 80 PLUS® Titanium CRPS power supplies delivering up to 9.6 kW of efficient, stable power
- Flexible storage configuration supporting up to 8 hot-swappable E1.S NVMe trays
Flagship Multi-GPU AI / HPC Server Platform
16-Slot Architecture Supporting 8-GPU AI Workloads with up to 9.6kW Power Capacity
AI / HPC applications
FHFL PCIe slots x 16
Supports up to 8 GPUs
Connectors
80×56 mm fans x 10 for GPU cooling
80×56 mm fans x 4 for system cooling
3+1 3200W CRPS
30” slide rails
Dual-Processor Synergy
for Extreme Performance Platform
Designed to support dual 5th Gen Intel® Xeon® Scalable processors, the IW-RG658 PRO offers up to 32 DDR5 ECC DIMM slots, enabling as much as 8TB of system memory for large-scale AI models and data-intensive applications. PCIe Gen5 connectivity provides high-bandwidth, low-latency communication required for optimal CPU-to-GPU performance in modern accelerated computing environments.
High Density GPU Architecture
The IW-RG658 PRO incorporates 16 FHFL PCIe slots, supporting up to 8 dual-slot GPUs. Optimized internal spacing and reinforced GPU retention brackets ensure structural integrity and reliability, even under the demands of large-scale, multi-GPU deployments. Designed for AI clusters, deep learning, and GPU-accelerated computing.
PCIe Gen5 Connectivity
A dedicated PCIe Gen5 converter board delivers high-bandwidth connectivity between the GPUs and motherboard. The MCIO (8i)-based architecture provides stable, low-latency signal transmission while simplifying system integration through, clean pre-routed connections. This design enables scalable multi-GPU expansion while maintaining the bandwidth required for next-generation AI accelerators.
Dual-Chamber Thermal Design
The IW-RG658 PRO utilizes a dual-layer airflow architecture that isolates GPU cooling from system cooling for maximum thermal efficiency. The upper chamber delivers dedicated high-volume airflow on to the GPUs, while the lower chamber maintains consistent cooling for the CPU, memory, and system components. A dedicated inter-chamber airflow duct helps streamline pressure balance, enhance heat dissipation, and minimize thermal interference between system zones, ensuring stable performance under continuous AI workloads.
Advanced Cooling System
To support high-density GPU configurations, the IW-RG658 PRO integrates a powerful airflow system.
• 10 front PWM fans dedicated to GPU cooling
• 4 rear fans for CPU and system airflow
With fan speeds reaching up to 17,000 RPM, the cooling architecture ensures stable thermal performance under heavy AI and HPC workloads.
• 10 front PWM fans dedicated to GPU cooling
• 4 rear fans for CPU and system airflow
With fan speeds reaching up to 17,000 RPM, the cooling architecture ensures stable thermal performance under heavy AI and HPC workloads.
Smart Fan Control
The IW-RG658 PRO includes dedicated fan control boards to manage GPU and system cooling zones. Two front fan boards regulate the 10 high-performance GPU cooling fans, while a rear fan board manages the 4 system fans for in the lower chamber. Integrated thermal sensors continuously monitor system temperatures and automatically adjust fan speeds to maintain optimal cooling performance under varying AI and HPC workloads.
Front hot-swap fans
Rear hot-swap fans
Titanium Power System
The IW-RG658 PRO utilizes a 3+1 3200W CRPS power configuration, delivering up to 9.6kW of total power capacity for demanding multi-GPU deployments. Its 80 PLUS® Titanium-certified power modules ensure efficient and stable power delivery for GPU-intensive AI and HPC environments.
Flexible Storage Expansion
The IW-RG658 PRO offers a flexible storage architecture for data-intensive workloads. Optional front E1.S PCIe Gen5 NVMe trays deliver ultra-fast storage performance, while pre-installed rear 2.5" hot-swap bays support system and OS drives.
NVMe E1.S 15mm hot-swap trays x 8 (Optional)
2.5" Hot-swap trays x 4
Designed for Easy Serviceability
The IW RG658 PRO is engineered for efficient deployment and streamlined maintenance in data center environments. Hot-swappable fan cages and storage trays allow quick servicing without system downtime, while tool-less components simplify upgrade installation and reduce maintenance time.
GPU bracket support
Hot swappable fan cage
Handles
Power Cable Information
Unit of Length: mm
- 4+4-Pin CPU x 2 (Pre-installed)
- 4+4-Pin CPU x 2 (Pre-installed)
- 12V-2x6 PCIe x 4
- 12V-2x6 PCIe x 4
- 4-Pin for Motherboard (Pre-installed)
- 6-Pin for GPU Converter Board x 2 (Pre-installed)
- 6-Pin for Fan Board x 3 (Pre-installed)
- Peripheral for Storage BP (Pre-installed)
- PMBus
- 12-Pin PDB to PDB Expansion Board Connector (Pre-installed)
| Specification | |
|---|---|
| Industry Standard | Compatible with EIA-RS310D standard 19" cabinets |
| Form Factor | 6.5U rackmount • 4.5U upper chamber for GPU (maximum length up to 360mm ) • 2U lower chamber for system components |
| M/B Form Factor | M/B Proprietary (16.93" x 13.79") |
| Processor | Support 2x 5th Gen Intel Xeon® Scalable processors, up to 350W |
| Memory | Support up to 8TB using 32x DDR5 ECC DIMMs, up to 4800MHz |
| GPU | Supports up to 8x NVIDIA RTX™ A6000 or RTX™ 6000 Pro GPUs |
| Drive Bay | Support: •External front NVMe E1.S 15mm hot-swap trays x 8 (Optional) •External rear 2.5" Hot-Swap trays x 4 (Pre-installed) |
| Power Supply | Pre-installed: • Form factor: 3+1 80 PLUS Titanium CRPS • Total Watt: 9600W |
| Indicators | Power LED, LAN 1/LAN 2, system LED, HDD LED |
| Front Control Panel | Power on/off, system reset, USB 3.0 x 2 |
| Cooling Fans | • Pre-installed 80 x 56 mm PWM front fans x 10, 17000 RPM for GPU cooling • Pre-installed 80 x 56 mm PWM rear fans x 4, 17000 RPM for M/B cooling |
| Expansion Slot | Full-height PCIe slots x 16 - Supports up to 8 x GPUs via 1 x PCIe converter board with MCIO cables to MB |
| Material | • Material: SGCC • Thickness: 1.2mm |
| Rail Kit | 30" tool-less & ball-bearing slide rails included |
| Product Dimensions (DxWxH; Chassis Only) | 650 x 490.60 x 288.9 mm (25.59" x 19.31" x 11.37") |
| Package Dimensions (DxWxH) | 980 x 630 x 489 mm (38.58" x 24.80" x 19.25") |
| Weight | • Net weight: 35.33 kg • Gross weight: 39.38 kg |
| Cubic Feet | 10.66 |
| Container Information | Single packing with pallets: • 20’: 48 pcs • 40’: 108 pcs • 40'HQ: 144 pcs |
* The actual product is subject to change without prior notice. In Win Development Inc. reserves the right to make any final modifications
* The adjacent image is for reference only. All hardware components and optional parts are not included.
* The adjacent image is for reference only. All hardware components and optional parts are not included.
| Item | Part Number | Description | Support | Picture |
|---|---|---|---|---|
| Slide Rail | 3RAMIS133301 | 30" tool-less & ball-bearing slide rails | 1 set |
|
| Power Supply | 3RAMAP048700 | 80 Plus Platinum 3200W CRPS (AC input 100~115V, total power 1340W max. / AC input 116~120V, total power 1600W max. / AC input 200~224V, total power 2800W max. / AC input 225-240V, total power 3200W max.) / CRPS PDB | Max. 4 |
|
| Cable | 3RAMW8014100 | Power cord American standard (IEC C19 3C#14,L1830mm,15A) | Max. 4 |
|
| Cable | 3RAMW8014500 | Power cord European standard (IEC C19 3G,1.5mm2,L1830mm,16A) | Max. 4 |
|
| Cable | 3RAMW8017000 | Power cord British standard (H05VV-F1.5mm2-3G,L1830mm,13A) | Max. 4 |
|
| Drive Tray | 2RAKIB115400 | 8-Bay E1.S Drive Module | Max. 2 Sets |
|